10a - Advanced PCB design techniques for cost-effective SI, PI and EMC

Advanced PCB techniques

Module 10A (replaces Module 10) 

This course is designed to help design engineers:-

– Reduce cost by eliminating enclosure shielding

– Reduce interference with co-located wireless datacoms (e.g. increase receiver range    for GSM, GPRS, 3G, 4G, etc.)...

– Allow co-located GPS antennas...

– Use RF power devices (including isolating DC/DC)...

– Make high-speed processors / DSP function correctly (achieve good signal integrity, SI, and power integrity, PI)...

– Use the latest IC technologies (e.g. 15nm or smaller silicon processes), BGAs and ‘chip scale’ packages...

– Reduce time to market and compliance costs 

Module is 353 slides over 177 pages


1 When should we use advanced PCB techniques?

2  Future trends and their implications

3  Guidelines, approximations, simulations, and virtual design for SI, PI and EMC

4  Advanced segregation (zoning) techniques

5  Advanced interface filtering and suppression, including BLS (board-level shielding) to tens of GHz

6  Advanced PCB-chassis bonding

7  Advanced PCB planes

8  The totally shielded board assembly 

9  Resonances in parallel planes: 0V(GND) or PWR

10  Advanced PCB decoupling

11  Buried components, especially buried capacitance decoupling

12  Traces crossing plane splits or changing layers

13  Advanced transmission lines, including differential signalling up to 32Gb/s

14  Microvia board manufacturing techniques, i.e. High Density Interconnect, HDI

15  Advanced crosstalk

16  Some final tips and tricks

17  Some useful contacts, sources, references 


« Back to SI, PI & EMC for Products & Equipment