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Part 7, Routing, Layer stacking, Microvias
This is the seventh in a series of eight articles on good-practice design techniques for electromagnetic compatibility (EMC) for printed circuit board (PCB) design and layout. This series is intended for the designers of any electronic circuits that are to be constructed on PCBs, and of course for the PCB designers themselves. All applications areas are covered, from household appliances; commercial, medical and industrial equipment; through automotive, rail and marine to aerospace and military.
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Electromagnetic Engineering (EMgineering) is the basis for proven good design practices for signal integrity (SI), power integrity (PI), and the control of EMI emissions and immunity (EMC).
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