Cost-Effective use of HDI PCB technology for SI, PI and EMC

Cost-Effective use of HDI PCB technology for SI, PI and EMC image #1

PCB manufacturing technology, also known as microvia technology, or Sequential Build-Up technology (or simply ‘Build-Up’) uses ‘microvias’ 6 thou (0.15mm) diameter or less, so can achieve twice the number of pins/area than THP and which only connect between necessary board layers, so don’t constrain routing on other layers, all of which means they can significantly reduce the number of PCB layers required especially where THP would require 10 layers or more.

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