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Cost-Effective use of HDI PCB technology for SI, PI and EMC
PCB manufacturing technology, also known as microvia technology, orSequential Build-Up technology (or simply ‘Build-Up’)uses ‘microvias’ 6 thou (0.15mm) diameter or less, socan achieve twice the number of pins/area than THPand which only connect between necessary board layers,so don’t constrain routing on other layers, all of which means they can significantly reducethe number of PCB layers requiredespecially where THP would require 10 layers or more.
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